Water-cooling heat dissipation system

ABSTRACT

A water-cooling heat dissipation system for dissipating a heat-generating device includes a water pump, a water-cooling apparatus, and a cooling apparatus. The water pump is configured for transferring coolant via a first pipe. The water-cooling apparatus is capable of mounted on the heat-generating device and receiving the coolant from the water pump via the first pipe to cool the heat-generating device, and then outputting heat absorbed coolant heated the heat from the heat-generating device. The cooling apparatus is configured for receiving the heat absorbed coolant from the water-cooling apparatus via a second pipe, and removing heat from the heat absorbed coolant, and then transferring the coolant to the water pump via a third pipe.

BACKGROUND

1. Technical Field

The present disclosure relates to dissipation systems and, particularly,to a water-cooling heat dissipation system.

2. Description of Related Art

In electronic devices, and particularly, computers, heat-generatingcomponents, such as CPUs, usually generate heat in operation. Generally,a heat sink is mounted on a heat-generating component to dissipate heatgenerated therefrom. However, very often, a heat sink for such aheat-generating component cannot satisfy the need for dissipating heatwhen the heat-generating component works in a highly loaded process or ahigh frequency mode.

What is needed is to provide a water-cooling heat dissipation system toovercome the above-described shortcomings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of an embodiment of a water-cooling heatdissipation system, the water-cooling heat dissipation system includinga water-cooling apparatus.

FIG. 2 is a cross-sectional view of the water-cooling apparatus of FIG.1, together with a heat-generating device.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, an exemplary embodiment of a water-coolingheat dissipation system includes a water-cooling apparatus 10, a waterpump 20, a cooling apparatus 30, and a plurality of pipes 40.

The water-cooling apparatus 10 is configured to be mounted on aheat-generating device, such as a central processing unit (CPU) 50. Inthe instant embodiment, the cooling apparatus 30 is a fan. The pipes 40connect and communicate with the water-cooling apparatus 10, the coolingapparatus 30, and the water pump 20. Coolant flows through a pipe 40from the water pump 20 into the water-cooling apparatus 10 toabsorb/remove heat from the CPU 50, and then heat absorbed coolant istransferred out of the water-cooling apparatus 10 into the coolingapparatus 30. The cooling apparatus 30 is configured to remove heat fromthe heat absorbed coolant, and then the coolant is transferred into thewater-cooling apparatus 10 via the water pump 20. Therefore, heat fromthe CPU 50 can be removed by the coolant continuously by thewater-cooling heat dissipation system.

The water-cooling apparatus 10 includes a heat sink 110, a fan blade120, a rotating shaft 130, a sealed cover 140, and a magnetic cover 150.

The heat sink 110 is configured to be attached on the CPU 50 to conductheat from the CPU 50. The sealed cover 140 is covered on the heat sink110 to form an sealed water proof space 60 surrounded by the sealedcover 140 and the heat sink 110. Two through holes 142 are defined intwo opposite sides of the sealed cover 140, for communicating the waterproof space 60 with the corresponding pipes 40.

The rotating shaft 130 is vertically mounted to a middle of the heatsink 110, and the fan blade 120 is positioned above the heat sink 110.Two permanent magnets 122 are mounted to two opposite ends of the fanblade 120, respectively. The magnetic cover 150 is covered on the sealedcover 140. Two electromagnets 152 are installed in two opposite sides ofthe magnetic cover 150, corresponding to the two permanent magnets 122.The two electromagnets 152 are connected to an external power supply160, such as a motherboard external power, via wires 154. The fan blade120 is rotatably mounted on the rotating shaft 130, and the fan blade120 is rotatable on the rotating shaft 130, which can accelerate waterto flow in the water proof space 60.

In use, the electromagnets 152 is powered by the power supply 160through the wires 154 to drive the fan blade 120 together with thecorresponding permanent magnets 122 to rotate around the rotating shaft130. Therefore, the water in the water proof space 60 can be propelledto flow and dissipate the heat from the CPU 50 quickly.

It is to be understood, however, that even though numerouscharacteristics and advantages of the present disclosure have been setforth in the foregoing description, together with details of thestructure and function of the disclosure, the disclosure is illustrativeonly, and changes may be made in detail, especially in matters of shape,size, and arrangement of parts within the principles of the disclosureto the full extent indicated by the broad general meaning of the termsin which the appended claims are expressed.

1. A water-cooling heat dissipation system for cooling a heat-generatingdevice, comprising: a water pump configured for transferring coolant viaa first pipe; a water-cooling apparatus capable of being mounted on theheat-generating device and receiving the coolant from the water pump viathe first pipe to cool the heat-generating device, and then outputtingheat absorbed coolant; and a cooling apparatus configured for receivingthe heat absorbed coolant from the water-cooling apparatus via a secondpipe, and removing heat from the heat absorbed coolant, and thentransferring the coolant to the water pump via a third pipe.
 2. Thewater-cooling heat dissipation system of claim 1, wherein thewater-cooling apparatus comprises a heat sink and a sealed cover, theheat sink is configured to be attached on the heat-generating device toconduct heat from the heat-generating device, the sealed cover iscovered on the heat sink to bound an water proof space together with theheat sink, two through holes are defined in two opposite sides of thesealed cover for communicating with the first and second pipes,respectively.
 3. The water-cooling heat dissipation system of claim 2,wherein the water-cooling apparatus further comprises a rotating shaftmounted to the heat sink, a fan blade rotatably mounted to the rotatingshaft, and a magnetic cover covered on the sealed cover, two permanentmagnets are mounted to opposite ends of the fan blade respectively, twoelectromagnets are installed in opposite sides of the magnetic covercorresponding to the two permanent magnets, the two electromagnets areconnected to an external power supply via wires, the fan blade iscapable of being rotated around the rotating shaft via the two permanentmagnets being driven by the two electromagnets when the electromagnetsis powered.
 4. The water-cooling heat dissipation system of claim 3,wherein the rotating shaft is mounted to a middle of the heat sink, thefan blade is positioned above the heat sink in the water proof space. 5.The water-cooling heat dissipation system of claim 1, wherein thecooling apparatus is a fan.
 6. A water-cooling apparatus for aheat-generating device, comprising: a heat sink configured to beattached on the heat-generating device to conduct heat from theheat-generating device; a sealed cover covered on the heat sink to boundan water proof space together with the heat sink, wherein two throughholes are defined in two opposite sides of the sealed cover forcommunicating with a first pipe allowing coolant to flow into the waterproof space and a second pipe allowing heat absorbed coolant heated bythe heat-generating device to flow out of the water proof space; arotating shaft mounted to the heat sink and received in the water proofspace; a fan blade rotatably mounted to the rotating shaft, wherein twopermanent magnets are mounted to two opposite ends of the fan blade; anda magnetic cover covered on the sealed cover, wherein two electromagnetsare installed in two opposite sides of the magnetic cover correspondingto the two permanent magnets, the fan blade is capable of being rotatedaround the rotating shaft via the two permanent magnets being driven bythe two electromagnets when the electromagnets is powered.
 7. Thewater-cooling apparatus of claim 6, wherein the rotating shaft ismounted to a middle of the heat sink, the fan blade is positioned abovethe heat sink.